WHAT IS SO 8 package?
SO8
| Toshiba Package Code | 11-5K1S |
|---|---|
| Packing Method | Embossed Tape / Tube Packaging |
| Packing Name | TP |
| Minimum Quantity | 2500 pcs/Reel |
| Tape Width (mm) | 12 |
What is SOIC component?
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less.
What is the difference between SOIC and TSSOP?
The SOIC is taller (1.75mm vs. 1.2mm) which is enough to make a difference in a thin product. The lead pitch is much closer (almost half) on the TSSOP- 0.65mm vs. 1.27mm, so for crude manufacturing processes the SOIC might well be preferred.
What is SSOP package?
The Shrink Small Outline Package , or SSOP, is a smaller or ‘shrunk’ version of the SOIC package, having a compressed body and a tightened lead pitch. SSOP lead counts range from 8 to 64. SSOP body widths come in 150, 209 and 300 mils while its body thickness typically ranges from 1.65 mm to 1.85 mm.
What is SOT package?
A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations, also manufacturers offer the nearly identical thin small outline transistor (TSOT) package, where lower height is important.
What does TSSOP stand for?
Thin-shrink small outline package (TSSOP)
Is SOP and SOIC the same?
Another name of SOP is called SOIC, JEDEC standard are called SOIC in the United States, and JEITA standard one is called SOP in Japan, and the body width of the former one is larger than the latter. It was developed to reduce space required on the substrate more than DIP.
What is the difference between TSSOP and SSOP?
SSOP package having leads in two side of periphery and having lead pitch less than 1.0mm, said package named Shrink Small Outline Package. TSSOP package having an encapsulant width less than 300mils covering entire package, having total height less than 1.2mm, said package named Thin Shrink Small Outline Package.
What is the difference between SSOP and SOIC?
SSOP, TSOP, are developed as a derivation of SOP. Another name of SOP is called SOIC, JEDEC standard are called SOIC in the United States, and JEITA standard one is called SOP in Japan, and the body width of the former one is larger than the latter.
What is SOP package in IC?
SOP. Small Outline Package. It is widely used typical surface mounting item. SOP makes the lead interval of DIP into half, and expands the lead for the surface mounting to the external Gull’s wing shape (Gull Wing). Further, the lead pin extending out from 4 way directions of the package is called QFP.
What is SON package?
Small Outline No Lead (SON) packages provide a small form factor at 0.4 and 0.5mm pitch. These are normally smaller pincount devices in a robust, plastic package compatible with all end equipment including automotive.
What are the types of IC packages?
The common flat pack IC packages are QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), STQFP (Small Thin Quad Plastic Flat Package), FQFP (Fine-pitch Quad Flat Package), HQFP (Quad Flat Package with Heat sink), LQFP (Low profile Quad Flat Package), VQFP (Very-small Quad Flat Package), MQFP (Metric Quad Flat …
What is PCB package?
integrated circuit printed circuit board PCB. Today in the market you can pcb board find a great variety of electronic component packages. It is common to find several types of packages for one device. For example you can find the same pcb board integrated circuit in QFP’s and LCC’s packages.
What is a SOT package?
Small Outline Transistor (SOT) packages are very small, inexpensive surface-mount plastic-molded packages with leads on their two long sides. Due to their low cost and low profile, SOT’s are widely used in consumer electronics. The SOT-23 and the SC-70 packages are two of the most widely used SOT packages today.